SOLDER WIRE
Qualitek paste flux is a combination of tackifier and fluxing agent specially formulated for touch-up soldering, BGA packages and flip chip applications. Paste flux may be applied by screen or stencil printing, pin-transfer and syringe dispensing. Paste Flux formulations are available for lead and lead free assembly in No-Clean, RMA, RA, and Water-Soluble formulations.
NO CLEAN
FLUX CORE
FEATURES
J-STD-004B
RoHS Compliant
NC611
No-Clean flux has excellent activity, clear residue and low flux spatter
REL0
Yes
NC600
No-Clean flux contains a very effective activator and spread like an RA flux. Available with several lead-free and leaded alloys.
REL0
Yes/No
NC601
No-Clean core flux has excellent spread properties leaving virtually no post-soldering residue. Available with several lead-free and leaded alloys.
ORL0
Yes/No
WATER SOLUBLE
FLUX CORE
FEATURES
J-STD-004B
RoHS Compliant
WS700
Formulated for electronic applications where fast wetting and ease of cleaning with water is required. Available with several lead-free and leaded alloys.
ORH1
Yes/No
ROSIN BASED
FLUX CORE
FEATURES
J-STD-004B
RoHS Compliant
RMA200
Rosin Mildly Activated flux formulated for high reliability electronic assembly. Available with several lead-free and leaded alloys.
ROL0
Yes/No
RA300
Rapid wetting, fast-flowing flux core that contains non-conductive post-soldering residues. Available with several lead-free and leaded alloys.
ROM1
Yes/No
SRA500
Super Rosin Activated flux core is recommended for highly oxidized or difficult to solder to metals. Available with lead-free alloys.
ROH1
Yes/No